The utilization of lasers can be highly beneficial in many processes. We believe that lasers can provide improvements in processes like soldering, scribing, cutting and marking.

The Cencorp laser soldering machine represents a new kind of approach, since components are simultaneously held with a robot and soldered underneath the PCB. That means combined component placement and lead-free laser soldering in one unit.

Laser soldering can also be used to solder components with poor tolerance for high temperatures, as laser soldering affects a very small area. Therefore, soldering is possible even where there are temperature sensitive components close to the solder joint. Robust, flexible and reproducible soldering processes enable unique tailoring to meet the material requirements of each process.